Delivery Time:Prototype 3 days, Mass Production 8 Days
Certification:ISO 9001:2008,ISO 14001:2004, UL, SGS, CTI
2.HASL suface finishing
3.short delivery time
4.small order are vailabe
5.OEM are provided
The PCB capability
We focus on high quality including quick turn PCB prototype , small volume, mid &Big volume PCB.
Capability:
-High Frequency (TACONIC material)/TG/Density/precision impedance controlled boards
-Heavy Copper PCB, Metal based PCB. Hard Gold PCB, Blind &Buried vias boards,
Halogen Free PCB, Aluminum-backed Boards
-Gold finger+ HAL & Leadfree HASL PCB, Leadfree compatible PCB
Our Product range
We offer a wide range of PCBs such as single-sided, double-sided, multi-layer, high frequency, MCPCB, metal-backed PCB and so on.
We can do for you:
1-16 layer FR-4 PCB board, 1-2 layer Aluminum PCB
1-6 oz copper thickness
0.2 mm hole size
0.1 mm line width/space
Our PCB are using for wide range of electronic products, such as project, amplifier, CCTV, power supply, GPS, Safety ,camera, set-top box, medical device, Telecommunication, LED light and so on.
3, How can we help you?
What we offer is better solutions to help you improve your quality while maintaining low production cost and be your longtime partner.
4, Can I ask you three questions?
(1)Do you have plans to import printed circuit board this year?
(2)If so, do you have plan to find an supplier in China?
(3)How can I Be a qualified supplier for you?
If our PCBs can meet your requirements,welcome to receive your enquiry or trial order for testing our price and quality. We will quote to you the best price for your reference as soon as we receive your specific inquiry.
Manufacturer Capability
|
Material |
FR-4 / Hi Tg FR-4 / Lead free Materials (RoHS Compliant) /CEM-3, Aluminium, Metal based |
|
Layer No. |
1-16 |
|
Finished Board thickness |
0.2 mm-3.8mm (8 mil-150 mil) |
|
Board Thickness Tolerance |
±10% |
|
Cooper thickness |
0.5 OZ-6OZ (18 um-210 um) |
|
Copper Plating Hole |
18-40 um |
|
Impedance Control |
±10% |
|
Warp&Twist |
0.70% |
|
Peelable |
0.012\"(0.3mm)-0.02 (0.5mm) |
|
Images |
|
|
Min Trace Width (a) |
0.075mm (3mil) |
|
Min Space Width (b) |
0.1mm (4 mil) |
|
Min Annular Ring |
0.1mm (4 mil) |
|
SMD Pitch (a) |
0.2 mm(8 mil) |
|
BGA Pitch (b) |
0.2 mm (8 mil) |
|
0.05mm |
|
|
Solder Mask |
|
|
Min Solder Mask Dam (a) |
0.0635 mm (2.5mil) |
|
Soldermask Clearance (b) |
0.1mm (4 mil) |
|
Min SMT Pad spacing (c) |
0.1mm (4 mil |
