Product Details

Chomerics T725 replacing pink thermal conductive PCM 0.95W/mK conductivity for PCB

The T725P Series is low melting point thermal interface material. At 50℃, The T725P Series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.The T725P Series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.

The T725P Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures.

Features
》0.024℃-in² /W thermal resistance
》Naturally tacky at room temperature, no adhesive required
》No heat sink preheating required

Applications
》High Frequency Microprocessors
》Notebook and Desktop PCs
》Computer Serves
》Memory Modules
》Cache Chips
》IGBTs

Typical Properties of T725P Series
Product Name	T725P				Testing standards
Color	Pink				Visual
Composite Thickness	0.005"
	(0.126mm)
Thickness Tolerance	±0.0008"(±0.019mm)
Density	2.2g/cc				Helium Pycnometer
Work Temperature	-25℃～125℃
phase transition temperature	50℃~60℃
Setting temperature	70℃ for 5 minutes
Thermal conductivity	0.95 W/mK				ASTM D5470 (modified)
Thermal lmpedance	0.021℃-in²/W	0.024℃-in²/W	0.053℃-in²/W	0.080℃-in²/W	ASTM D5470 (modified)
@ 50 psi(345 KPa)	0.14℃-cm²/W	0.15℃-cm²/W	0.34℃-cm²/W	0.52℃-cm²/W