Z-Paster 140-20-11F Series is a high performance and compatible non-silicone material of the thermal conductive interface materials.The role is to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.

It applies to the liner based on silicone suitably. The flexibility and elasticity make it suited to the coating of the very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.

Features

Silicone-free 
ROSH compliance
Good thermal conductive:2.0 W/mK
Soft and Compressible for low stress applications
Available in varies thickness

Application

Cooling components to the chassis of frame 
Car Battery & Power Supply 
Charging Pile 
Silicone-sensitive applications 
Graphics Card Thermal Module
Set Top Box 
Medical devices 
LED Lighting 
SFP optical module 
Miniature heat tube radiator