Product Details

Good performance thermal conductive silicone free gap pad for no-silicone required case

Z-Paster140-15-02F Series is a high performance and compatible non-silicone material of the thermal conductive interface materials.The role is to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.

It applies to the liner based on silicone suitably. The flexibility and elasticity make it suited to the coating of the very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.

Features

Silicone-free
ROSH compliance
Good thermal conductive:1.5 W/mK
Soft and Compressible for low stress applications
Available in varies thickness

Application

Cooling components to the chassis of frame
Car Battery & Power Supply
Charging Pile
Silicone-sensitive applications
Graphics Card Thermal Module
Set Top Box
Medical devices
LED Lighting
SFP optical module
Miniature heat tube radiator

Typical Properties of Z-Paster140-15-02F
Product Name	Z-Paster140-15-02F
Colour	Gray/White
Construction & Compostion	Silicone-free The metal oxide fills
Thermal conductivity	1.5 W/mK
Hardness	65 Shore 00
Specific Gravity	2.55 g/cc
Thickness range	0.010"-0.200" (0.25mm-5.0mm)
Dielectric Breakdown Voltage (T= 1mm above)	>5000 VAC
Dielectric Constant	5.5 MHz
Volume Resistivity	6.3X1013 Ohm-meter
Continuous Use Temp	– 20 To 125℃
Outgassing (TML)	0.30%
Flame Rating	94 V0