Product Details

Mobile, desktop paste low bleed and evaporation white heat conductive grease

The TIG™780-18 products are the high-efficiency heat dissipation ones for the fillings between the electronic components and the heat dissipation fins. They serve to moisten the contact surface sufficiently so as to form an interface of extremely low thermal impedance. Consequently, the heat dissipation efficiency is far superior to that offered by others.

Features

0.05 ℃-in² /W thermal resistance

One component paste like interface material, never dry

Thermal compound formulated to maximize the heat transfer

Outstanding electrical insulation properties and will not harden on long exposure to elevated temperatures

Non-toxic and environmentally safe

Applications

Semiconductor cases and heat sinks

Power resistors and chassis, thermostats and mating surfaces, and thermoelectric cooling devices

CPU's and GPU's

Automatic dispensing and screen-printing

Typical Properties of TIG™780-18Series
Product Name	TIG™780-18
Colour	White
Construction & Compostion	Metal oxide filled silicone oil
Viscosity	1800K cps @.25℃
Specific Gravity	2.5 g/cm3
Evaporation	0.15% / 200℃@24hrs
Continuous Use Temp	-49℉ to 392℉ / -45℃ to 200℃
Thermal lmpedance	0.05℃-in²/W @ 50 psi(344 KPa)
Thermal conductivity	1.8 W/mK