The TIF™160-30-11S thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.

Features

Good thermal conductive: 3 W/mK 
Naturally tacky needing no further adhesive coating 
Soft and Compressible for low stress applications
Available in varies thickness

Applications

Cooling components to the chassis of frame 
High speed mass storage drives
Heat Sinking Housing at LED-lit BLU in LCD
LED TV and LED-lit lamps
RDRAM memory modules 
Micro heat pipe thermal solutions 
Automotive engine control units
Telecommunication hardware
Handheld portable electronics
Semiconductor automated test equipment (ATE)