Product Details

Memory Modules applicated grey Ultra thin thermal conductive low melting point thermal pad pcm phase change materials

The TIC™805G Series is low melting point thermal interface material. At 50℃, The TIC™805G Series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.The TIC™805G Series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.

The TIC™805G Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures.

Features

Cost Effective

Easy to handle in the manufacturing environment

No heat sink preheating required

Re-flow compatible

Applications

High Frequency Microprocessors

Custom ASICs

Computer Serves

Waterproof LED Power Supply

Memory Modules

Cache Chips

IGBTs

Typical Properties of TIC™805G Series
Product Name	TIC™805G
Colour	Gray
Composite Thickness	0.005" (0.13 mm)
Specific Gravity	2.6 g /cc
Work Temperature	-25℃~125℃
phase transition temperature	50℃~60℃
Setting temperature	70℃ for 5 minutes
Thermal conductivity	5 W/mK
Thermal lmpedance @ 50 psi(345 KPa)	0.013℃-in²/W