FR 4 High Tg PCB Red Solder Mask 3 Microinch Gold For System Integration

FR 4 High Tg PCB Red Solder Mask 3 Microinch Gold For System Integration

Negotiable /Piece

Min.Order:1 Piece

Supply Ability:
0 Piece / Pieces per Month
Payment Terms:
T/T L/C D/P D/A
Delivery Detail:
7 days

Quick Details View All >

Brand Name:
BICHENG
Place of Origin:
China
Model Number:
BIC-1516-VER2.2

BICHENG ENTERPRISE LIMITED

Business Type: Trading Company
Main Products:

Product Details

Delivery Time:10-12 working days
Certification:UL

FR 4 High Tg PCB Red Solder Mask 3 Microinch Gold For System Integration

PCB Data Sheets

PCB SIZE 160 x 260mm=3PCS
BOARD TYPE  
Number of Layers Multilayer PCB, 4 Layer PCB
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper ------- 35um(1oz)+plate TOP layer
Prepreg 7628 0.195mm
copper ------- 18um(0.5oz) MidLayer 1
FR-4 1.0mm
copper ------- 18um(0.5oz) MidLayer 2
Prepreg 7628 0.195mm
copper ------- 35um(1oz)+plate BOT Layer
TECHNOLOGY  
Minimum Trace and Space: 5.9mil/7.4mil
Minmum / Maximum Holes: 0.787/5.0mm
Number of Different Holes: 12
Number of Drill Holes: 3250
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control no
BOARD MATERIAL  
Glass Epoxy: FR-4, ITEQ IT-180 TG>170, er<5.4
Final foil external: 1.5oz
Final foil internal: 1oz
Final height of PCB: 1.6mm ±0.16
PLATING AND COATING  
Surface Finish Immersion Gold (33.4%) 3 micoinch over 100 microinch nickle
Solder Mask Apply To: Top and Bottom, 12micron Minimum
Solder Mask Color: Red
Solder Mask Type: LPSM
CONTOUR/CUTTING Routing, Fiducial Marks
MARKING  
Side of Component Legend TOP
Colour of Component Legend White, IJR-4000 MW300, Taiyo Supplied.
Manufacturer Name or Logo: Marked on the board in a conductor and leged FREE AREA
VIA Plated Through Hole(PTH), via tented
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE  
Outline dimension: 0.0059"
Board plating: 0.0029"
Drill tolerance: 0.002"
TEST 100% Electrical Test prior shipment
APPLICATION: System integration
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

Advantages

a) Lead-Free Assembly Compatible, RoHS compliant and suitable for high thermal reliability needs, and Lead free assemblies with a maximum reflow temperature of 260℃

b) Excellent surface planarity, particularly helpful for PCBs with BGA packages or even CSP mounted components to reduce failure rate during assembly and soldering.

c) Meeting your printed circuit board needs from PCB prototyping to mass volume production.

d) No minimum order quantity. 1-10 pieces are offered for sale.

More Applications in Electronics

Gateway
Rfid
Inverter
Antenna
Wifi Booster

Contract Manufacturing Services
Low Cost Plc
Embedded Systems Development
Embedded Computer Systems
Ac Power Supplies

IT-180 Data Sheets (Properties)

ITEQ Laminate/ Prepreg : IT-180ATC / IT-180ABS
IPC-4101C Spec / 99 / 101 / 126
LAMINATE( IT-180ATC)
Property Thickness<0.50 mm Thickness≧0.50 mm Units Test Method
[0.0197 in] [0.0197 in]
Typical Value Spec Typical Value Spec Metric IPC-TM-650
(English) (or as noted)
Peel Strength, minimum         N/mm 2.4.8
A. Low profile copper foil and very low profile copper foil - all copper weights > 17mm [0.669 mil]         (lb/inch) 2.4.8.2
B. Standard profile copper foil 0.88 (5.0) 0.70 (4.00) 0.88 (

Contact Supplier

Mr. Kevin Liao sale Manager Chat Now
Telephone
86-755-27374946
Mobile
86-75527374946
Fax
86-755-27374847
Skype
liao.chundong
Address
3 203 Shidai Jingyuan Fuyong Town Lishui,Zhejiang

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