Delivery Time:12 working days
Certification:UL

1.6mm White Dual Layer Pcb Board Assembly Tg 135 Circuit Board With Holes

PCB data sheets

PCB SIZE	221 x 198mm=72PCS=2types
BOARD TYPE
Number of Layers	Double sided PCB
Surface Mount Components	YES
Through Hole Components	YES
LAYER STACKUP	copper ------- 17.8um(0.5oz)+plate TOP layer
	FR-4 1.5mm
	copper ------- 17.8um(1oz)+plate BOT Layer
TECHNOLOGY
Minimum Trace and Space:	5.5mil/6.47mil
Minmum / Maximum Holes:	0.3mm/3.6mm
Number of Different Holes:	12
Number of Drill Holes:	934
Number of Milled Slots:	72
Number of Internal Cutouts:	0
Impedance Control	no
BOARD MATERIAL
Glass Epoxy:	FR-4, ITEQ IT-140 TG>135
Final foil external:	1oz
Final foil internal:	0oz
Final height of PCB:	1.6mm ±0.16
PLATING AND COATING
Surface Finish	HASL, Lead Free, Sn>=2.54µm
Solder Mask Apply To:	Top and Bottom, 12micon Minimum.
Solder Mask Color:	White
Solder Mask Type:	LPSM
CONTOUR/CUTTING	Routing
MARKING
Side of Component Legend	TOP
Colour of Component Legend	Black
Manufacturer Name or Logo:	Marked on the board in a conductor and leged FREE AREA
VIA	Plated Through Hole(PTH), via tented.
FLAMIBILITY RATING	UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:	0.0059" (0.15mm)
Board plating:	0.0030" (0.076mm)
Drill tolerance:	0.002" (0.05mm)
TEST	100% Electrical Test prior shipment
APPLICATION:	Monitoring Systems
TYPE OF ARTWORK TO BE SUPPLIED	email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA	Worldwide, Globally.

Advantages

a) Normal Tg is OK for general electronics device. Making the purchasing cost saved.

b) HASL has excellent wetting during component soldering and it can avoid copper corrosion.

c) No MOQ for buyer. 1-11 pieces are offered for sale.

d) DDU Door to door shipment with competitive shipping cost. You don’t need to arrange anything after confirming the order. Just wait for your PCB delivery to your hand.

More Applications in Electronics

Converter Dc Dc
Contract Manufacturers
Embedded Solutions
Power Supply Regulated
Programmable Controllers

15.2 PCB Production Process (16)

1. Contact PCB fabricator

Contact your satisfied vendor such as Bicheng. You’re registered and will be quoted for you. Place your order and follow up the production schedule.

2. Material cutting

Purpose: According to the requirement from engineering data, cut the large plate which is in compliance with the requirement into small pieces of production board piece to meet customer requirements of the small sheet.

3. Drill

Purpose: According to the requirement from engineering data, drill all the holes.

4. Copper deposition

Purpose: Copper deposition is a thin copper deposit on the wall of the insulating hole by chemical method

5. Pattern transfer

Purpose: Pattern transfer is the transfer of image production on the film to the board

6. Pattern plating

Purpose: Pattern electroplating is a layer of copper or gold over nickel or tin that requires a thickness plated on the exposed copper of the pattern graphic or on the hole wall.

7. Film stripping

Purpose: The NaOH solution is used to strip the anti-plating film to expose the non-pattern circuit layer.

8. Etching

Purpose: Etching is to etch off the non-circuit parts of the copper layer by chemical reaction method

9. Solder Mask

Purpose: Solder mask is transferring the solder mask film graphics to the board to protect the track and prevent the track from the effect of tin welding during assembly.

10. Silkscreen

Purpose: The silkscreen character is a mark