Delivery Time:10-12 working days
Certification:UL

RO4350B High Frequency PCB  0.8mm Thick with Immersion Gold Applied In Balanced Amplifier

PCB parameter

PCB SIZE	193 x 192mm=1PCS
BOARD TYPE
Number of Layers	Double sided PCB, 2 Layer PCB
Surface Mount Components	YES
Through Hole Components	YES
LAYER STACKUP	copper ------- 17.8um(0.5oz)+plate TOP layer
	RO4350B 30mil (0.762mm)
	copper ------- 17.8um(1oz)+plate BOT Layer
TECHNOLOGY
Minimum Trace and Space:	11.97mil
Minmum / Maximum Holes:	0.3/2.8mm
Number of Different Holes:	2
Number of Drill Holes:	195
Number of Milled Slots:	5
Number of Internal Cutouts:	0
Impedance Control	No
BOARD MATERIAL
Glass Epoxy:	RO4350B 30mil (0.762mm), Tg 288℃
Final foil external:	1oz
Final foil internal:	0oz
Final height of PCB:	0.8mm ±0.1
PLATING AND COATING
Surface Finish	Immersion Gold (16.2%) 2 micoinch over 100 microinch nickle
Solder Mask Apply To:	Top and Bottom, 12micron Minimum
Solder Mask Color:	Green, NAN YA, LP-4G/G-05
Solder Mask Type:	LPSM
CONTOUR/CUTTING	Routing, Fiducial Marks
MARKING
Side of Component Legend	TOP
Colour of Component Legend	White, S-380W, Taiyo Supplied.
Manufacturer Name or Logo:	Marked on the board in a conductor and leged FREE AREA
VIA	Plated Through Hole(PTH), via tented
FLAMIBILITY RATING	UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:	0.0059" (0.15mm)
Board plating:	0.0030" (0.076mm)
Drill tolerance:	0.002" (0.05mm)
TEST	100% Electrical Test prior shipment
APPLICATION:	Balanced amplifier
TYPE OF ARTWORK TO BE SUPPLIED	email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA	Worldwide, Globally.

Advantages

a) RO4350B High frequency material. Excellent high frequency performance,  low dielectric tolerance and loss

b) Immersion gold surface finish, Good oxidation resistance and good heat dissipation.

c) No MOQ, low cost for small quantity prototypes and samples.

d) Meeting your printed circuit board needs from PCB prototyping to mass volume production.

More Applications in Electronics

Usb Adapter
Modems
Led Lighting
Power Amplifier
Wireless Adapter

Security Electronics
Digital Repeater
Power Supply System
Power Supply Circuits
48 Vdc Power Supply

PCB knowledge:The Difficulty Factors for Multilayer boards

Multilayer PCB’s represent one of the most complicates products in PCB industry. In order to design producible multilayer PCB’s, it is imperative that PCB designers understand the processes and difficulty factors

*Build-up

The more layers in a multilayer PCB’s, the greater risk of mis-registration during laminate process. The difficulty factor, therefore, increase with an increasing layer counts.

*Core thickness of rigid inner laminates

Inner layers are normally based on thin rigid laminate cores with copper cladding. The thinner the rigid laminates, the more difficult they are to handle, for example, in the etching process.

*Thickness tolerance (total thickness inclusive of copper foils)

The difficulty factor and the rejection rate depend very much upon the thickness tolerance required, and indirectly upon the layer build-up. When thickness tolerance T=±10%, obviously rejection ratio trends to zero.

FAQ

Do you sell via in pad PCB?
Yes. Via in pad (VIP) is a good real estate saving. We offer this kind of PCB for many applications like microcontroller, GPRS etc.