FR 4 Tg 135 Double Sided PCB Design Immersion Silver For Security Systems
Negotiable /Piece
Min.Order:1 Piece
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FR 4 Tg 135 Double Sided PCB Design Immersion Silver For Security Systems
PCB parameters
PCB SIZE | 120 x 79mm=4PCS |
BOARD TYPE | |
Number of Layers | Double sided PCB |
Surface Mount Components | YES |
Through Hole Components | YES |
LAYER STACKUP | copper ------- 17.8um(0.5oz)+PLATE |
FR-4 1.0mm | |
copper ------- 17.8um(0.5oz)+PLATE | |
TECHNOLOGY | |
Minimum Trace and Space: | 4mil/4mil |
Minmum / Maximum Holes: | 0.5/3.8mm |
Number of Different Holes: | 4 |
Number of Drill Holes: | 135 |
Number of Milled Slots: | 1 |
Number of Internal Cutouts: | 0 |
Impedance Control | no |
BOARD MATERIAL | |
Glass Epoxy: | FR-4, ITEQ IT-140 TG>135 |
Final foil external: | 1oz |
Final foil internal: | 0oz |
Final height of PCB: | 1.0mm ±0.1 |
PLATING AND COATING | |
Surface Finish | Immersion Silver, Ag>0.15µm |
Solder Mask Apply To: | Top and Bottom, 12micon Minimum. |
Solder Mask Color: | Green, LP-4G G-05, Nanya supplied |
Solder Mask Type: | LPSM |
CONTOUR/CUTTING | Routing |
MARKING | |
Side of Component Legend | TOP |
Colour of Component Legend | White, S-380W, Taiyo Supplied. |
Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
VIA | Plated Through Hole(PTH), via tented. |
FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE | |
Outline dimension: | 0.0059" (0.15mm) |
Board plating: | 0.0030" (0.076mm) |
Drill tolerance: | 0.002" (0.05mm) |
TEST | 100% Electrical Test prior shipment |
APPLICATION: | Security systems, Antenna Wifi Wifi USB Adapter Wifi Bridge Buck Converter Wlan Adapter |
TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA | Worldwide, Globally. |
Advantages:
a) Immersion silver surface finish
b) Panel form to save SMT process room
c) Thickness at 1.0mm, suitable for USB portable products
d) FR-4 94V0 flame retardant, Convenient and safe.
More applications in electronics
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Data Sheet of Design for Manufacturing(DFM) (1)
Serial NO. | Procedure | Item | Manufacturing capability | ||
Large volume (S<100 m²) | Middle volume (S<10 m²) | Prototype(S<1m²) | |||
1 | Inner layer (18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value ) | Min.isolation of layers | 0.1mm | 0.1mm | 0.06mm |
2 | Min.track and spacing | 5/5mil(18um) | 4/4mil(18um) | 3/3.5mil(18um) | |
3 | 5/5mil(35um) | 4/4mil(35um) | 3/4mil(35um) | ||
4 | 7/9mil(70um) | 6/8mil(70um) | 6/7mil(70um) | ||
5 | 9/11mil(105um) | 8/10mil(105um) | 8/9mil(105um) | ||
6 | 13/13mil(140um) | 12/12mil(140um) | 12/11mil(140um) | ||
7 | Min.distance from drill to conductor | 4 Layer 10mil,6 layer 10mil,8-12 layer 12mil | 4 layer 8mil,6 layer 8mil,8-12 layer 10mil,14-20 layer 14mil,22-32 layer 18mil | 4 layer 6mil,6 layer 6mil,8-14 layer 8mil,16-22 layer 12mil,24-32 layer 14mil | |
8 | Min.width of annular ring on inner layer | 4 Layer 10mil(35um),≥6 Layer 14mil(35um) | 4 Layer 8mil(35um),≥6 layer 12mil(35um) | 4 Layer 6mil(35um),≥6 Layer 10mil(35um) | |
9 | Inner layer isolation ring width(Min) | 10mil (35um) | 8mil (35um) | 6mil (35um) | |
10 | Min.via pad diameter | 20mil (35um) | 16mil (35um) | 16mil (35um) | |
11 | Min. distance from board edge to conductor(no copper exposured)(inner layer) | 14 mil(35um) |