Product Details

CPU Heatsink Cooling 3.8W Thermal Conductive Grease thermal conductive gap filler

The TIG™780-25 products are the high-efficiency heat dissipation ones for the fillings between the electronic components and the heat dissipation fins. They serve to moisten the contact surface sufficiently so as to form an interface of extremely low thermal impedance. Consequently, the heat dissipation efficiency is far superior to that offered by others.

Features

> 0.05℃-in²/W thermal resistance
> One component paste like interface material, never dry
> Thermal compound formulated to maximize the heat transfer
> Outstanding electrical insulation properties and will not harden on long exposure to elevated temperatures
> Non-toxic and environmentally safe

Applications lnclude

> CPU

> display card

> mainboard/mother board

> notebook

> power supply

> Heat pipe thermal solutions

> Memory Modules

> Mass storage devices

> Automotive electronics

> Set top boxes

Typical Properties:

Typical Properties of TIG™780-25 Series
Product Name	TIG™780-25
Colour	Gray
Construction & Compostion	Metal oxide filled silicone oil
Viscosity	1800K cps @.25℃
Specific Gravity	2.5 g/cm3
Evaporation	0.15% / 200℃@24hrs
Continuous Use Temp	-49℉ to 392℉ / -45℃ to 200℃
Thermal lmpedance	0.05℃-in²/W @ 50 psi(344 KPa)
Thermal conductivity	2.5 W/mK