Xc7a15t-2ftg256i ftbga-256 programmable logic device has the lowest price
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Shenzhen nanbeihang Electronic Development Co., Ltd
describe
Xilinx ® 7 Series FPGAs includes four FPGA series to meet the complete system requirements, from low-cost, small shape, cost sensitive and high-capacity applications to the highest connection bandwidth, logic capacity and signal processing capacity. Seven series of FPGA include:
•Spartan ®- 7 Series: optimized for low cost, low power consumption and high performance
I / O performance. The price is low and the overall size is very small
Minimum PCB package.
•Artix ®- 7 Series: optimized for low power applications requiring serial communication
Transceiver and high DSP and logic throughput. Provide minimum
High throughput bill of materials, total cost, cost sensitive
Application.
•Kintex ®- 7 Series: pass 2x
Compared with the previous generation, it has improved and implemented a new class, which is FPGA.
•Virtex ®- 7 Series: for the highest system performance and
The system performance is improved by twice the capacity. highest
High performance devices via stacked silicon interconnect (SSI)
technology
Based on the most advanced, high-performance, low-power (HPL), 28nm, high-k metal gate (HKMG) process technology, 7 Series FPGAs enables unparalleled improvement of system performance with 2.9tb/si/o bandwidth, 2 million logic unit capacity, and 5.3tmac/sdsp. At the same time, it consumes more power than the previous generation equipment, providing a fully programmable alternative to ASSPS and ASIC.
Characteristics
• advanced high-performance FPGA logic based on real 6 input look-up table (LUT) technology that can be configured as distributed memory.
• 36 KB dual port block RAM with built-in FIFO logic for on-chip data buffer.
• High Performance Options ™ Technology supporting DDR3
Interface up to 1866 MB / s.
• high speed serial connection with built-in 10 Gigabit transceiver
From 600 MB / s to up to 6.6 GB / s to 28.05 GB / s, provides
The special low-power mode is optimized for the interface between chips.
• a user configurable analog interface (xadc) with dual
12 bit 1msps analog-to-digital converter with on-chip thermal and
Supply sensor.
• DSP chip with 25 x 18 multiplier, 48 bit accumulator and pre adder
For high-performance filtering, including optimized symmetric coefficient filtering.
• powerful clock management block (CMT) combined with phase locking
Loop (PLL) and mixed mode clock manager (MMCM) modules are used for high performance
Precision and low jitter.
• rapid deployment of embedded processing with MicroBlaze ™ processor
• for PCI Express ® (PCIe) for up to X8 gen3
Endpoint and root port design.
• multiple configuration options, including
Memory with 256 bit encryption, hma-sha
Authentication, and built-in SEU detection and correction.
• low cost, wire bonding, bare chip flip chip and high signal integrity flip chip packaging to facilitate migration between family members
The same package. All packages are lead-free and optional
Package in Pb option.
• designed for 28 nm high performance and minimum power consumption,
HKMG, HPL process, 1.0V core voltage process technology and 0.9V core voltage option, lower power.