In recent years, metallized ceramic circuits plate (substrate) is extensively applied in the area, including LED packaging board, LED COB board, IGBT power module board, vehicle electronic circuit board, refrigeration chip board, HCPV circuit board, medical electronic product circuit board, etc. All ought to be attributed to the excellent physical properties of insulation voltage resistance, chemical stability and thermal conductivity of great value (The aluminum dioxide thermal conductivity: 20 ~ 27W/m K; the aluminum nitride thermal conductivity: 170 to 190/m. K.).

Due to the need of related applications, the circuits ought to be made on the two sides of the substrate and the circuits of two sides should be connected by filling conductive materials through panel holes (Through Hole Via Filling) in most of the ceramic substrates. Furthermore, sometimes large current is needed to seal holes since using copper plating to fill panel holes is one of the mostly used techniques to fill holes. There are many factors affecting the quality of electroplating hole-filling such as machinery equipment, material condition, electroplating technique, electroplating solution, etc. In order to solve the problem of applying DC electroplating to hole-filling, we adopt the pulse electroplating. Pulse electroplating is actually a kind of on-off DC electroplating. The positive and negative pulse is that the positive pulse is tightly followed by the reverse pulse with the alternate output according to the set cycle. Pulse electroplating can improve the quality of electroplating. Compared with the electroplating formed by DC power, pulse electroplating has better performance of deep plating, corrosion resistance, abrasion resistance, purity, conductivity, welding and resistance to discoloration. Moreover, it is more time and cost saving.