this section of the ceramic substrate design concept is to allow high power, small size, high brightness LED use 

development designed to replace a section merit system board, directly to multiple LED chip package on top, 

and then by the second optical lens more compact size makes the product volume and let your light LED 

products reduce the area, reducing materials, system cost, the human cost of replacing the assembly, so 

that you package more quickly, Wire bonding the chip directly on the substrate, with the use of ceramic 

heat with excellent results, but also allow your LED brighter and longer life. 

This product suitable for high power LED's package, such as:  LED lights