The ceramic PCB material for semiconductor refrigeration chip packages generally refers to the ceramic substrate material used in the manufacture of semiconductor refrigeration chip packages. It has excellent thermal conductivity, mechanical strength, and temperature stability, making it suitable for use in harsh electronic equipment and semiconductor device applications such as high-frequency, high-power, and high-temperature applications, such as lasers, power amplifiers, high-performance LED lighting, wireless communication equipment, etc. Common semiconductor refrigeration chip package ceramic PCB materials include AMB, AlN, AI2O3, etc., among which AMB material is a ceramic material with high thermal conductivity and high electrical insulation performance commonly used in the manufacture of semiconductor refrigeration devices.