With the continuous upgrading and optimization of electronic products, the requirements of PCB, the carrier of its components, are also rising, resulting in the emergence of ceramic circuit boards. Then, what are the advantages of ceramic based circuit boards over traditional glass fiber (FR-4), aluminum based and copper based circuit boards?

1. stable warpage

Ordinary PCBs are usually made by bonding copper foil to the substrate, while most of the substrate materials are glass fiber (FR-4), phenolic resin (fr-3), aluminum, copper, PTFE, composite ceramics and other materials, and the adhesives are usually phenolic, epoxy, etc. In the process of PCB processing, due to thermal stress, chemical factors, improper production technology and other reasons, or due to the asymmetry of copper laying on both sides in the design process, it is easy to lead to different degrees of warpage of PCB.

The ceramic circuit board has a hard material, good heat dissipation performance and low coefficient of thermal expansion. At the same time, the ceramic circuit board bonds the copper and the substrate by magnetron sputtering, which has a strong bonding force, the copper foil will not fall off and high reliability, thus avoiding the warping problem of ordinary PCB;

2. large carrying capacity:

100A current continuously passes through 1mm0.3mm thick copper body, with a temperature rise of about 17 ℃; 100A current continuously passes through 2mm0.3mm thick copper body, and the temperature rise is only about 5 ℃;

3. thermal conductivity:

The thermal conductivity of alumina of ceramic circuit board can reach 15~35, and that of aluminum nitride can reach 170~230,. Because in the case of high bonding strength, its coefficient of thermal expansion will be more matched, and the test tensile value can reach 45 MPa.

4. thermal conductivity:

The thermal conductivity of high thermal conductivity aluminum substrate is generally 1-4w/m. K, while the thermal conductivity of ceramic substrate can reach about 220w/m. K according to its preparation method and material formula.

5. low thermal resistance:

ten × The thermal resistance of 10mm ceramic substrate is 0.31k/w for 0.63mm thick ceramic substrate, 0.19k/w for 0.38mm thick ceramic substrate, and 0.14k/w for 0.25mm thick ceramic substrate.

6. good insulation performance, high withstand voltage, ensuring personal safety and equipment, strong bonding force, using bonding technology, copper foil will not fall off, high reliability, and stable performance in high temperature and humidity environment.

7. high frequency performance is stable. AK and DK values are lower than those of PTFE and conforming ceramics.

To sum up, ceramic circuit boards have been widely used in high-power power electronic modules, solar panel components, high-frequency switching power supplies, solid-state relays, automotive electronics, aerospace, military electronics, high-power LED lighting products, communication antennas, automotive sensors, refrigeration chips and other fields by virtue of their advantages.