Introduction:

The target size of the VTC-16-D compact DC magnetron plasma sputtering device is 2 inches, and the height of the sample stage can be adjusted. This coating instrument design is mainly to make some metal film, the largest film area is 4 inches.

Features:

1. Especially for the SEM sample plating conductive film design.

2, small size, simple operation, easy to use.

3, with a small magnetron target, can be plated gold and silver and other metals.

Technical Parameters

1. Input power: 220V AC 50/60Hz

2, power: 200W

3, the output voltage: 500 VDC

4, sputter current: 0-50 mA adjustable

5, sputtering time: 0-120S adjustable

6, sputtering cavity

1) Quartz cavity, size: 166 mm OD x 150 mm ID x 150 mm H

2) Seal: O-ring seal with stainless steel flat flange

7, sputter head & sample stage

l) The sputtering head can be installed with a target diameter of 2 inches and a thickness of 0.1 - 2.5mm

      2) Sputtering time adjustable 1-120S

3) The instrument is equipped with a stainless steel sample table with a diameter of 50mm, and the distance between the sputtering head and the sputtering head is adjustable from 30-80mm.

      4) Optional heated sample stage, the maximum heating temperature is 500 °C

      5) A manually operated sputter shield is installed for pre-sputtering

6) Diameter of the largest membrane that can be made: 4 inches (for reference only, click here for details)

8, vacuum system

l) KF25 vacuum interface is installed

2) digital vacuum pressure gauge (Pa)

3) This system can run into gas operation

4)< 1.0E-2 Torr (with mechanical pump)

5) < 1.0E-5 Torr (using vortex molecular pump)

9, intake

l) The device is equipped with a 1/4 inch air inlet to facilitate the connection of gas cylinders

   2) An airflow adjustment knob is installed on the front panel of the device to facilitate airflow adjustment

10, target

   l) Target size requirements: Φ50mm × (0.1 - 2.5) mm (thickness)

   2) The equipment is standard copper target

11, product size

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