Delivery Time:10 working days
Certification:UL

Black Double Sided Printed Circuit Boards 2 Layer PCB for Bluetooth Receiver

PCB Data sheets

PCB SIZE	250 x 236mm=50PCS
BOARD TYPE
Number of Layers	Double sided PCB, 2 Layer PCB
Surface Mount Components	YES
Through Hole Components	YES
LAYER STACKUP	copper ------- 35um(1oz)+plate TOP layer
	FR-4 1.5mm
	copper ------- 35um(1oz)+plate BOT Layer
TECHNOLOGY
Minimum Trace and Space:	8.5mil/6.5mil
Minmum / Maximum Holes:	0.3/0.9mm
Number of Different Holes:	2
Number of Drill Holes:	1365
Number of Milled Slots:	0
Number of Internal Cutouts:	0
Impedance Control	no
BOARD MATERIAL
Glass Epoxy:	FR-4, ITEQ IT-180 TG>170, er<5.4
Final foil external:	1.5oz
Final foil internal:	0oz
Final height of PCB:	1.6mm ±0.16
PLATING AND COATING
Surface Finish	Immersion Gold (14.3%) 2micoinch over 100 microinch nickle
Solder Mask Apply To:	Top and Bottom, 12micron Minimum
Solder Mask Color:	Black, Kuangshun, SKM-S6189BK31
Solder Mask Type:	LPSM
CONTOUR/CUTTING	Routing, Fiducial Marks, V-cut
MARKING
Side of Component Legend	No silkscreen required.
Colour of Component Legend	No silkscreen required.
Manufacturer Name or Logo:	No silkscreen required.
VIA	Plated Through Hole(PTH), via tented
FLAMIBILITY RATING	UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:	0.0059"
Board plating:	0.0029"
Drill tolerance:	0.002"
TEST	100% Electrical Test prior shipment
APPLICATION:	Bluetooth receiver
TYPE OF ARTWORK TO BE SUPPLIED	email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA	Worldwide, Globally.

Advantages

a) High Tg FR-4. Industrial standard material with high Tg (175℃ by DSC) and excellent thermal reliability.

b) Immersion gold. SMT process is resistant to reflow soldering, resistant to rework.

c) Devlivery on time: >98%

d) Customer complaint rate: <1%

More Applications in Electronics

Gsm
Server
Hdmi Splitter
Outdoor Lighting
Routers

Low Noise Rf Amplifier
Custom Power Supply
Ac To Dc Power Supplies
Power Supply Socket
Security Access Systems

PCB knowledge: ENIG

ENIG stands for Electroless nickel immersion gold which is a type of surface plating used for circuit boards. It consists of an electroless nickel plating covered with a thin layer of immersion gold. Normally, the thickness of nickel is 120µ” - 200µ” (3µm to 5µm ) and gold 1-5µ” (0.025µm – 0.127µm).

ENIG has several advantages than HASL, including

a) Excellent surface planarity, particularly helpful for PCBs with BGA packages or even CSP mounted components to reduce failure rate during assembly and soldering.

b) Good oxidation resistance and good heat dissipation.

c) Long storage time ( It can be stored for more than 1 year in vacuum bag)

d) High solderability, no stressing of circuit boards and less contamination of PCB surface.

e) SMT process is resistant to reflow soldering, resistant to rework.

FAQ

How to Pay?
We accept bank wire transfer, Paypal. It's sorry, we currently do not accept credit card.