Delivery Time:10 working days
Certification:UL

SAN Storage 4 Layer Tg 170 PCB FR 4 Immersion Gold Lead Free 1.5oz

PCB Data sheets

PCB SIZE	132 x 155mm=20PCS
BOARD TYPE
Number of Layers	Multilayer PCB, 4 Layer PCB
Surface Mount Components	YES
Through Hole Components	YES
LAYER STACKUP	copper ------- 35um(1oz)+plate TOP layer
	Prepreg 7628 0.195mm
	copper ------- 35um(1oz) MidLayer 1
	FR-4 1.0mm
	copper ------- 35um(1oz) MidLayer 2
	Prepreg 7628 0.195mm
	copper ------- 35um(1oz)+plate BOT Layer
TECHNOLOGY
Minimum Trace and Space:	7.87mil/6mil
Minmum / Maximum Holes:	0.5/1.0mm
Number of Different Holes:	2
Number of Drill Holes:	975
Number of Milled Slots:	46
Number of Internal Cutouts:	0
Impedance Control	no
BOARD MATERIAL
Glass Epoxy:	FR-4, ITEQ IT-180 TG>170, er<5.4
Final foil external:	1.5oz
Final foil internal:	1oz
Final height of PCB:	1.6mm ±0.16
PLATING AND COATING
Surface Finish	Immersion Gold (23.4%) 2micoinch over 100 microinch nickle
Solder Mask Apply To:	Top and Bottom, 12micron Minimum
Solder Mask Color:	Gloss Green, Taiyo PSR-2000GT600D
Solder Mask Type:	LPSM
CONTOUR/CUTTING	Routing, Fiducial Marks
MARKING
Side of Component Legend	TOP
Colour of Component Legend	White, IJR-4000 MW300, Taiyo Supplied.
Manufacturer Name or Logo:	Marked on the board in a conductor and leged FREE AREA
VIA	Plated Through Hole(PTH), via tented
FLAMIBILITY RATING	UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:	0.0059"
Board plating:	0.0029"
Drill tolerance:	0.002"
TEST	100% Electrical Test prior shipment
APPLICATION:	SAN storage
TYPE OF ARTWORK TO BE SUPPLIED	email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA	Worldwide, Globally.

Advantages

a) High Tg 170 material. Lead-Free Assembly Compatible, RoHS compliant and suitable for high thermal reliability needs, and Lead free assemblies with a maximum reflow temperature of 260℃

b) Immersion gold. Good oxidation resistance and good heat dissipation.

c) 100% tests inclusive of electrical test and AOI inspection.High voltage test, Impedance control test, micro-section, solder-ability test, thermal stress test, reliability test, insulation resistance test and ionic contamination test etc.

d) Eligible products rate of first production: >95%

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PCB Knowledge: HASL

Hot air solder leveling is for short HASL, which is a common type of surface finish used on printed circuit boards (PCBs). We dipped the PCBs (with exposed copper surfaces) into a bath of molten solder, then remove the excess solder on PCB surface and in the holes by strong hot air(which we call it HASL machine) to get a glossy layer of coating.

One is alloy of tin and lead. The temperature of smelting furnace for Tin/Led is about 240℃. Another one is pure tin, because lead is harmful to human body, EU has forbidden using tin/lead. So the popular is pure tin or HASL Lead free. The temperature of smelting furnace for pure tin is highly at 300℃, and plus the operating environment, high temperature and high etching are great harm on PCB itself. Due to its hot air generated, HASL has low planarity. It makes this surface finish unsuitable for use with fine pitch components. It has hidden danger of board warp or twist under high thermal stress. To avoid this disadvantages, high Tg material and PP are took into consideration for some PCB user. But it also has excellent wetting durin