Specifications

Thermal Pad Material
1.Thermal conductivity:3.0w/m.k
2.UL certificateion
3.High thermal performance
4.Approved quality

Thermal Pad Material

 

Features&Benefits:

-Thermal conductivity:3.0w/m.k

-High thermal performance at cost effective

-Slightly tacky on both sides

-Low stress application

-Electrical isolating

 

Typical Application Includes:

-High power applications

-Notebook computers

-LED Lighting

-Mass storage drives

-Between CPU and heat spreaders

-Wireless/wireline communication devices

 

Configurations:

-Sheet form,die-cut parts 

-Tape application available

 

Size available:

200x400mm

 

Thickness available:

0.5-5.0mm,increment by 0.5mm

 

Properties:

Typical Properties of Thermal Pad Material LD8300
Property	Unit	Metric Value	Test Method
Color	***	Blue	Visual
Thickness	mm	0.5~5.0	ASTM  D374
Density	g/cc	2.7	ASTM  D792
Hardness	Shore C	25±5	ASTM  D2240
Tensile Strength	KN/m	0.29	ASTM  D412
Continuous Use Temp.	°C	-40-150°C	EN 344
Electrical
Breakdown Voltage	Kv/mm	≥4.8	ASTM  D149
Volume Resistivity	Ω.cm	3.2×1016	ASTM  D257
Flame rating	V-0	V-0	UL  94
Thermal
Thermal Conductivity	W/m.k	3.0	ASTM D5470

For more details and application direction of thermal pad material,welcome to contact our sales!