Product Details

Thermal Conductive Adhesive Transfer Tapes

Features & Benefits:

-High bond strength to surfaces

-Thermal conductive and electrically isolating

-Excellent wet-out and high thermal performance

Configurations:

-Sheet form/roll form/die-cut parts

Available Thickness:

-0.1, 0.15, 0.2, 0.25, 0.3mm -Max.width:1030mm

Typical Application Includes:

-Where need mount heat sink onto BGA graphic/drive processor

-Where need mount heat spreader onto power converter PCB/Motor

-LED Lighting

Typical properties of 8F10
Properties	8F10-T10		8F10-T15		8F10-T20		8F10-T25	8F10-T30
Reinforced Material	Fiberglass		Fiberglass		Fiberglass		Fiberglass	Fiberglass
Thickness	0.1mm		0.15mm		0.2mm		0.25mm	0.3mm
Peel Strength (PSTC-101)(N/25mm)	>13.72		>13.72		>13.72		>13.72	>13.72
Temp Resistance(S) °C (°F)	180(356)		180(356)		180(356)		180(356)	180(356)
Temp Resistance(L) °C (°F)	120(248)		120(248)		120(248)		120(248)	120(248)
Continues Use. Temp. (°C)	-20 to 120		-20 to 120		-20 to 120		-20 to 120	-20 to 120
Adhesion
Retention (1Kg/Inch/25°C)	>48	>48		>48		>48		>48
Adhesion(Kg/Inch)	1.1	1.4		1.4		1.4		1.4
Initial Bonding Strength(Kg/Inch)	0.6	1.3		1.3		1.3		1.3
Electricity
Breakdown Voltage	2	2.5		3.5		4		6
Thermal
Thermal conductivity (ASTM D5470)	1.0W/M.K	1.0W/M.K		1.0W/M.K		1.0W/M.K		1.0W/M.K

Remark:

a. Data for design engineer spec. reference only. Engineers are reminded to test the material in application.

b. Shelf life: 15 months from date of manufacture when stored at storage temperature 23±5 ° C ,relative humidity is 60% in the products original packaging.