Specifications

Thermal Pads GPU
Good thermal interface material for laptop/notebooks
High conformability
Electrical isolating

Thermal Pads GPU

 

Features&Benefits:

1.Thermal conductivity:2.0W/m.k

2.High conformability and low hardness
3.Electrically insulating

 

Typical Application:

1.Laptop,module in computer

2.Between electronic components such as Semiconductor,IC,CPU,MOS and heatsink

3.Cooling Module,Thermal module,in all applications where metel housing is used as heatsink

 

Configurations:

-Sheet form,die-cut parts 

-Tape application available

 

Size available:

200x400mm

 

Thickness available:

0.5-12.0mm,increment by 0.5mm

 

Properties:

Typical Properties of Gap Pad LD8200
Property	Unit	Metric Value	Test Method
Color	***	Dark Grey	Visual
Thickness	mm	0.5-10.0	ASTM  D374
Density	g/cc	2.8	ASTM  D792
Hardness	Shore C	25±5	ASTM  D2240
Tensile Strength	KN/m	0.33	ASTM  D412
Continuous Use Temp.	°C	-40-150°C	EN 344
Electrical
Breakdown Voltage	Kv/mm	≥6.0	ASTM  D149
Volume Resistivity	Ω.cm	1.0×1016	ASTM  D257
Flame rating	V-0	V-0	UL  94
Thermal
Thermal Conductivity	W/m.k	2.0	ASTM D5470