Thermal Pad Material

Features&Benefits:

-Thermal conductivity:3.0w/m.k

-High thermal performance at cost effective

-Slightly tacky on both sides

-Low stress application

-Electrical isolating

Typical Application Includes:

-High power applications

-Notebook computers

-LED Lighting

-Mass storage drives

-Between CPU and heat spreaders

-Wireless/wireline communication devices

Configurations:

-Sheet form,die-cut parts 

-Tape application available

Size available:

200x400mm

Thickness available:

0.5-5.0mm,increment by 0.5mm

For more details and application direction of thermal interface material,welcome to contact our sales!