3m thermal gap filler

Features&Benefits:

1.Thermal conductivity:2.0W/m.k

2.High conformability and low hardness
3.Electrically insulating

Typical Application:

1.Laptop,module in computer

2.Between electronic components such as Semiconductor,IC,CPU,MOS and heatsink

3.Cooling Module,Thermal module,in all applications where metel housing is used as heatsink

Configurations:

-Sheet form,die-cut parts 

-Tape application available

Size available:

200x400mm

Thickness available:

0.5-12.0mm,increment by 0.5mm

Properties:

For more details and application direction of 3m thermal gap filler ,welcome to contact our sales!