Semiconductor packaging is a very complicated process, in which the chip frame baking (ovening) process is to put the frame sealed in the previous process into the oven for drying and curing. At this time, Donghongxin's buffer hanging basket will be used. It is made of high quality 304 stainless steel for laser cutting, bending and grinding. The surface is smooth and burr-free. It is simple and convenient to use.