The TSSOP package  toasting electroplating carrier is a necessary carrier for the  toasting and sealing process of the chip package lead frame. It is not only resistant to high temperature, but also has high precision to operate together with the equipment. It uses high-quality 304 stainless steel for precision laser cutting, bending and surface grinding. The product is safer and more durable to use. The etching number processing can quickly find the location where the product is stored, and facilitate the inventory to improve the production efficiency of the workshop.