Tg135 PCB Prototype Service Shengyi FR-4 Multilayer Circuit Board
Negotiable /Piece
Min.Order:1 Piece
Wireless Module High Tg FR4 PCB Double Sided Printed Circuit Board Fabrication
High Layer Double Sided PCB 0.8mm Thick High Speed Circuit Design
1.6 mm Double Sided PCB Design Services Immersion Silver Plating
Blue 10 Layer High Tg PCB 1oz FR 4 4mil Prepreg High Layer Count PCB
Voltage Converter High Temperature Pcb Multilayer Circuit Board 8 Layer
Four Layer Tg135 Blind Via PCB Immersion Gold Satellite Antenna Circuit Board
Tg135 PCB Prototype Service Shengyi FR-4 Multilayer Circuit Board
PCB properties
PCB SIZE | 170 x 182mm=5PCS |
BOARD TYPE | |
Number of Layers | Multilayer PCB, 6 Layer PCB |
Surface Mount Components | YES |
Through Hole Components | YES |
LAYER STACKUP | copper ------- 18um(0.5oz)+plate TOP layer |
Prepreg 7628 0.195mm | |
copper ------- 35um(1oz) MidLayer 1 | |
FR-4 0.4mm | |
copper ------- 35um(1oz) MidLayer 2 | |
Prepreg 7628 0.195mm | |
copper ------- 35um(1oz) MidLayer 3 | |
FR-4 0.4mm | |
copper ------- 35um(1oz) MidLayer 4 | |
Prepreg 7628 0.195mm | |
copper ------- 18um(0.5oz)+plate BOT Layer | |
TECHNOLOGY | |
Minimum Trace and Space: | 8mil/6mil |
Minmum / Maximum Holes: | 0.9/4.5mm |
Number of Different Holes: | 5 |
Number of Drill Holes: | 1475 |
Number of Milled Slots: | 0 |
Number of Internal Cutouts: | 0 |
Impedance Control | NO |
BOARD MATERIAL | |
Glass Epoxy: | FR-4, Shengyi S1140, TG>135, er<5.4 |
Final foil external: | 1oz |
Final foil internal: | 1oz |
Final height of PCB: | 1.6mm ±0.16 |
PLATING AND COATING | |
Surface Finish | HASL ,Lead Free, Sn>=2.54µm |
Solder Mask Apply To: | Top and Bottom, 12micon Minimum. |
Solder Mask Color: | Green, PSR-2000GT600D, Taiyo supplied. Peelabel mask. |
Solder Mask Type: | LPSM |
CONTOUR/CUTTING | Routing, v-cut, Fiducial marks |
MARKING | |
Side of Component Legend | TOP |
Colour of Component Legend | White, IJR-4000 MW300, Taiyo Supplied. |
Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
VIA | Plated Through Hole(PTH), via tented. |
FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE | |
Outline dimension: | 0.0059" (0.15mm) |
Board plating: | 0.0030" (0.076mm) |
Drill tolerance: | 0.002" (0.05mm) |
TEST | 100% Electrical Test prior shipment |
APPLICATION: | Embedded system |
TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA | Worldwide, Globally. |
Advantages
a) FR-4 grade epoxy glass. RoHS compliant and suitable for thermal reliability needs,and Lead free assemblies with a maximum reflow temperature of 260℃
b) PCB manufacturing on required specifications. Right manufacturing instruction (MI), comprehensive equipment management and maintenance and process control, strict WIP inspection and monitoring as well as working instruction, all those make the whole fabrication process totally controlled.
c) 100% tests inclusive of electrical test and AOI inspection.High voltage test, Impedance control test, micro-section, solder-ability test, thermal stress test, reliability test, insulation resistance test and ionic contamination test etc.
d) No MOQ, low cost for small quantity prototypes and samples.
More Applications in Electronics
AC Adaptor
Wireless Modem Router
Wifi Antena
Wireless Modems
Cable Router
Portable Sound System
Pos System
Projection System
Security Systems
Sound System
PCB knowledge: PCB prodution process
1. Contact PCB fabricator
Contact your satisfied vendor such as Bicheng. You’re registered and will be quoted for you. Place your order and follow up the production schedule.
2. Material cutting
Purpose: According to the requirement from engineering data, cut the large plate which is in compliance with the requirement into small pieces of production board piece to meet customer requirements of the small sheet.
3. Drill
Purpose: According to the requirement from engineering data, drill all the holes.
4. Copper deposition
Purpose: Copper deposition is a thin copper deposit on the wall of the insulating hole by chemical method
5. Pattern transfer
Purpose: Pattern transfer is the transfer of image production on the film to the board
6. Pattern plating
Purpose: Pattern electroplating is a lay