Product Details

Custom CEM-1 CEM-3 PCB Multi Layer Circuit Board Assembly Services

Brand Name HUASWIN
Place of Origin China
Model Number HSPCBA1076

Product Features

Delivery Time:15-20 working days
Certification:ISO/UL/RoHS

 
Custom CEM-1 CEM-3 PCB Multi Layer Circuit Board Assembly Services
 
 
Specifications

1. Material Sourcing Service

2. SMT assembly and Through hole components insertion 
3. IC pre-programming / Burning on-line
4. Function testing as requested 
5. Complete Unit assembly ( which including plastics, metal box, Coil, cable inside etc) 
6. Packing design 
7. Quantities range from prototype to medium batch production. 
8.100% E-Test

PCB capability and services: 


1. Single-sided, double-sided & multi layer PCB (up to 30 layers)
2. Flexible PCB (up to 10 layers)
3. Rigid-flex PCB (up to 8 layers) 
4. CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material. 
5. HAL, HAL lead free, Immersion Gold/ Silver/Tin, Hard Gold, OSP surface treatment. 
6. Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB standard. 
7. Quantities range from prototype to volume production. 
8. 100% E-Test 
 

PCB Assembly services: 
 
SMT Assembly 


Automatic Pick & Place 
Component Placement as Small as 0201 
Fine Pitch QEP - BGA 
Automatic Optical Inspection 
 
Through-hole Assembly 


Wave Soldering 
Hand Assembly and Soldering 
Material Sourcing 
IC pre-programming / Burning on-line 
Function testing as requested 
Aging test for LED and Power boards
Complete unit assembly (which including plastics, metal box, Coil, cable assembly etc) 
Packing design
 
 
Conformal coating


Both dip-coating and vertical spray coating is available. Protecting non-conductive dielectric layer that is 
applied onto the printed circuit board assembly to protect the electronic assembly from damage due to 
contamination, salt spray, moisture, fungus, dust and corrosion caused by harsh or extreme environments.
 When coated, it is clearly visible as a clear and shiny material.

Complete box build


Complete \'Box Build\' solutions including materials management of all components, electromechanical parts, 
plastics, casings and print & packaging material
 

Testing Methods


AOI Testing
Checks for solder paste 
Checks for components down to 0201\" 
Checks for missing components, offset, incorrect parts, polarity
X-Ray Inspection
X-Ray provides high-resolution inspection of: 
BGAs 
Bare boards 


In-Circuit Testing
In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by 
component problems. 
Power-up Test
Advanced Function Test
flash Device Programming
Functional testing

Application

Products are applied to a wide range of High-tech industries such as: LED, telecommunication, computer application, lighting, game machine, industrial control, power, automobile and high-end consumer electronics, ect. By unremitting work and effort to the marketing, products exports to American, Canada, Europe counties, Africa and other Asia-pacific countries

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