Delivery Time:15-20 working days
Certification:ISO/UL/RoHS

ENIG Finished 3 OZ Copper PCB Lead Free Soldering PCB Board Assembly services  

Specifications

Layer: 2 Layer  Material: FR-4  Board Thickness: 2.0mm  Surface Treatment: Lead Free HASL   Solder Mask: Green  Size: 87.22mm x 65.86mm  Copper Thickness: 3OZ  Min. Line Spacing: 0.3mm  Min Trace Space: 0.3mm 

PCB capability and services: 

1. Single-sided, double-sided & multi-layer PCB (up to 30 layers)
2. Flexible PCB (up to 10 layers)
3. Rigid-flex PCB (up to 8 layers) 
4. CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material. 
5. HAL, HAL lead free, Immersion Gold/ Silver/Tin, Hard Gold, OSP surface treatment. 
6. Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB standard. 
7. Quantities range from prototype to volume production. 
8. 100% E-Test 

PCBA capabilities: 

Single- or double-sided mixed technology or SMT (Surface Mount) for PCB assembly

ROHS capability

IPC-A-610E and IPC/EIA-STD workmanship operation


Quality Assurance:
 
ISO9001 and ISO/TS16949 management systems
Lean production system
ERP and PTS system support for management

Quality Processes: 

1. IQC: Incoming Quality Control (Incoming Materials Inspection)
2. First Article Inspection (FAI) for every process 
3. IPQC: In Process Quality Control
4. QC: 100% Test & Inspection
5. QA: Quality Assurance based on QC inspection again
6. Workmanship: IPC-A-610, ESD
7. Quality Management based on CQC, ISO9001:2008, ISO/TS16949

Testing Methods

AOI Testing
Checks for solder paste 
Checks for components down to 0201\" 
Checks for missing components, offset, incorrect parts, polarity

X-Ray Inspection
X-Ray provides high-resolution inspection of: 
BGAs 
Bare boards 

In-Circuit Testing
In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by 

component problems. 
Power-up Test
Advanced Function Test
Flash Device Programming
Functional testing

Factory View: