Delivery Time:15-20 working days
Certification:ISO/UL/RoHS

 
Professional Round PCB Turnkey PCB Assembly for Digital Photo Frame
 
 
Specifications

1.  High quality,reasonable price 
2.  No MOQ rules 
3.  Fast delivery time 
4. OEM and ODM orders welcomed 

Digital Photo Frame PCBA
 
1.Material:FR4 ,CEM1,CEM3 ECT
2.Layer: 8 layers
3.Board Thickness: 1.6mm
4.Copper Thickness:1 OZ
5.Min. Line Width: 0.5mm
6.Min. space :0.5mm
7.Solder mask color :Green, Red, White, Yellow, Black, Blue
 
 
Quotation Requirement :
 
Following specifications are needed for quotation:
1) Base material:
2) Board thickness:
3) Copper thickness:
4) Surface treatment:
5) Color of solder mask and silkscreen:
6) Quantity
7) Gerber file &BOM
 
 
PCB capability and services: 

1. Single-sided, double-sided & multi-layer PCB (up to 30 layers)
2. Flexible PCB (up to 10 layers)
3. Rigid-flex PCB (up to 8 layers) 
4. CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material. 
5. HAL, HAL lead free, Immersion Gold/ Silver/Tin, Hard Gold, OSP surface treatment. 
6. Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB standard. 
7. Quantities range from prototype to volume production. 
8. 100% E-Test 
 
 
Detailed Specification of PCB Manufacturing
 

1	layer	1-30 layer
2	Material	CEM-1, CEM-3 FR-4, FR-4 High TG,  Polyimide,  Aluminum-based  material.
3	Board thickness	0.2mm-6mm
4	Max.finished board size	800*508mm
5	Min.drilled hole size	0.25mm
6	min.line width	0.075mm(3mil)
7	min.line spacing	0.075mm(3mil)
8	Surface finish	HAL, HAL Lead free,Immersion Gold/  Silver/Tin,  Hard Gold, OSP
9	Copper thickness	0.5-4.0oz
10	Solder mask color	green/black/white/red/blue/yellow
11	Inner packing	Vacuum packing,Plastic bag
12	Outer packing	standard carton packing
13	Hole tolerance	PTH:±0.076,NTPH:±0.05
14	Certificate	UL,ISO9001,ISO14001,ROHS,TS16949
15	Profiling punching	Routing,V-CUT,Beveling

 
PCB Assembly services: 
 
SMT Assembly 

Automatic Pick & Place 
Component Placement as Small as 0201 
Fine Pitch QEP - BGA 
Automatic Optical Inspection 
 
Through-hole Assembly 

Wave Soldering 
Hand Assembly and Soldering 
Material Sourcing 
IC pre-programming / Burning on-line 
Function testing as requested 
Aging test for LED and Power boards
Complete unit assembly (which including plastics, metal box, Coil, cable assembly etc) 
Packing design
 
 
Conformal coating

Both dip-coating and vertical spray coating is available. Protecting non-conductive dielectric layer that is 
applied onto the printed circuit board assembly to protect the electronic assembly from damage due to 
contamination, salt spray, moisture, fungus, dust and corrosion caused by harsh or extreme environments.
 When coated, it is clearly visible as a clear and shiny material.

Complete box build

Complete \'Box Build\' solutions including materials management of all components, electromechanical parts, 
plastics, casings and print & packaging material
 

Testing Methods

AOI Testing
·Checks for solder paste 
·Checks for components down to 0201\" 
·Checks for missing components, offset, incorrect parts, polarity
X-Ray Inspection
X-Ray provides high-resolution inspection of: 
·BGA