Main Products: Alumina Ceramic Substrates ,Honeycomb Ceramic Substrate ,Catalytic Converter Substrate
High Hardness Industrial Alumina Ceramic Metal Bonding With Epoxy Resin
Negotiable /Kilogram
Min.Order:1 Kilogram
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Business Type: Trading CompanyMain Products: Alumina Ceramic Substrates ,Honeycomb Ceramic Substrate ,Catalytic Converter Substrate
High Intension Thermal Shock Resistance Metal Ceramic Bonding For Mechanical
Precision Custom Alumina Ceramic Metal Bonding Parts ROHS Hardness 85
High Precision Alumina Ceramic Metal Bonding Parts / Components With Epoxy Resin
Dry Pressing 95% / 99% / 99.7% High Alumina Ceramic To Metal Bonding OEM
High Temperature Resistant Aluminum Oxide / Alumina / Al2O3 Ceramics With Metal
High Temperature Wear Resistant 95% , 99%, 99.7% Al2O3 /Alumina Ceramic Metal Bonding
Product Details
High Hardness Industrial Alumina Ceramic Metal Bonding With Epoxy Resin
Description:
The technic of Ceramic with Metal is: adhere the ceramic and metal part with epoxy resin, according to customer’s demands
The material of ceramic part is 95%/99%/99.7% alumina, forming methods are dry pressing and CIP.
Product size is precise, little warp; joint strength between metal and ceramic is high; the joint area is close.
Applications:
Mechanical,electronics,chemical,textile,aeronautic and other fields.
Specifications:
95%,99%,99.7% Al2O3 Material Parameters:
|
Item |
Test Condition |
Unit Symbol |
95%Alumina ceramics |
99%Alumina ceramics |
99.7%Alumina ceramics |
|
The main chemical ingredient |
Al2O3 |
Al2O3 |
Al2O3 |
||
|
Bulk Density |
g/cm3 |
3.6 |
3.89 |
3.96 |
|
|
Maximum Use Temperature |
1450℃ |
1600℃ |
1650℃ |
||
|
Water absorption |
% |
0 |
0 |
0 |
|
|
ROHS Hardness |
≥85 |
≥89 |
≥89 |
||
|
Flexural strength |
20° C |
MPa (psi x 103) |
358 (52) |
550 |
550 |
|
Compressive Strength |
20° C |
MPa (psi x 103) |
2068 (300) |
2600(377) |
2600(377) |
|
Fracture Toughness |
K(I c) |
Mpa m1/2 |
4-5 |
5.6 |
6 |
|
Coefficient of thermal expansion |
25-1000° C |
1X 10-6/°C |
7.6 |
7.9 |
8.2 |
|
Coefficient of thermal conductivity |
20° C |
W/m °K |
16 |
30.0 |
30.4 |
|
Thermal Shock Resistance |
Tc |
°C |
250 |
200 |
200 |
|
Dielectricity constant |
1MHz.25℃ |
9 |
9.7 |
9.7 |
|
|
Dielectric strength |
ac-kV/mm (ac V/mil) |
8.3 (210) |
8.7 (220) |
8.7 (220) |
|
|
Volume Resistivity |
100℃ |
ohm |
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