Main Products: Alumina Ceramic Substrates ,Honeycomb Ceramic Substrate ,Catalytic Converter Substrate
High Precision Alumina Ceramic Metal Bonding Parts / Components With Epoxy Resin
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Min.Order:1 Set
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Business Type: Trading CompanyMain Products: Alumina Ceramic Substrates ,Honeycomb Ceramic Substrate ,Catalytic Converter Substrate
Dry Pressing 95% / 99% / 99.7% High Alumina Ceramic To Metal Bonding OEM
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Product Details
High Precision Alumina Ceramic Metal Bonding Parts / Components With Epoxy Resin
Description:
The material of ceramic part is 95%/99%/99.7% alumina, forming methods are dry pressing and CIP.
Product size is precise, little warp; joint strength between metal and ceramic is high; the joint area is close.
The technic of Ceramic with Metal is: adhere the ceramic and metal part with epoxy resin, according to customer’s demands
Applications:
Mechanical,electronics,chemical,textile,aeronautic and other fields.
Specifications:
95%,99%,99.7% Al2O3 Material Parameters:
|
Item |
Test Condition |
Unit Symbol |
95%Alumina ceramics |
99%Alumina ceramics |
99.7%Alumina ceramics |
|
The main chemical ingredient |
Al2O3 |
Al2O3 |
Al2O3 |
||
|
Bulk Density |
g/cm3 |
3.6 |
3.89 |
3.96 |
|
|
Maximum Use Temperature |
1450℃ |
1600℃ |
1650℃ |
||
|
Water absorption |
% |
0 |
0 |
0 |
|
|
ROHS Hardness |
≥85 |
≥89 |
≥89 |
||
|
Flexural strength |
20° C |
MPa (psi x 103) |
358 (52) |
550 |
550 |
|
Compressive Strength |
20° C |
MPa (psi x 103) |
2068 (300) |
2600(377) |
2600(377) |
|
Fracture Toughness |
K(I c) |
Mpa m1/2 |
4-5 |
5.6 |
6 |
|
Coefficient of thermal expansion |
25-1000° C |
1X 10-6/°C |
7.6 |
7.9 |
8.2 |
|
Coefficient of thermal conductivity |
20° C |
W/m °K |
16 |
30.0 |
30.4 |
|
Thermal Shock Resistance |
Tc |
°C |
250 |
200 |
200 |
|
Dielectricity constant |
1MHz.25℃ |
9 |
9.7 |
9.7 |
|
|
Dielectric strength |
ac-kV/mm (ac V/mil) |
8.3 (210) |
8.7 (220) |
8.7 (220) |
|
|
Volume Resistivity |
100℃ |
ohm-cm |
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