Name: Best soldering machine three heating bga rework station for lenovo g580 laptop motherboard
Brand: Shuttle Star
Availability: InStock

Product Details

Best soldering machine three heating bga rework station for lenovo g580 laptop motherboard

Product Description

Specification

Applicable PCB Size	W50mmD50mm~W430mmD350mm
Applicable BGA Size	7mm7mm~55mm55mm
Max BGA Weight	80g
Upper heater(Hot Air)	600w
Lower heater(Hot Air)	800w
Bottom Preheat IR heater	2400w
Machine Dimension	650mm500mm600mm
Machine Weight	36KG
Power supply	AC 220V 4KW

Three temperature zone of our BGA rework station:

1) Top hot air heater

2) Bottom hot air heater

3) Bottom IR preheat

Equipped with vacuum pen to pick up BGA

Special clapms help to fix the PCB motherboard

Real-time temperature curve can be displayed on operation interface

With different alloy hot gas nozzles, suit for different kind of BGA

Other Features

1. Made of high quality heating material; desoldering and soldering procedures of BGA are precisely controlled;

2. Movable heating head, which is able to move freely horizontally, easy to operated;

3. Embedded industrial computer, PLC control, real-time profile display, able to display set profile

and practically-tested profile; big size screen, easy to operate;

4. Profile saving no limit in this industrial computer, can analyze the two practically-tested profiles,

can input both English and Chinese;

5. The temperatures of the upper and lower hot air heaters can be precisely controlled according to

their specific temperatures. The infrared constant temperature heating zone at the bottom area and
the appropriate temperature-control settings make the rework safer and more reliable.

6. The supports for the BGA soldering supporting frame are micro-adjustable to restrain local sinkage.

7. Powerful cross flow fans cool the lower heating area rapidly;

8. The adjustable PCB positioning support, onto which the special fixtures for alloyed board could be installed,enables easy and fast positioning of the PCB board;

9. Buzz after soldering is finished or desoldering; Hand vacuum pen is adjustable for removing BGA;

10.Both the upper and lower parts are equipped with over-temperature alarming and protection apparatus.

11.With different alloy hot gas nozzles, easy to replace. It could be tailored as per the specific requirements.

12.The integrated design of machine and chassis is room-saving. could be altered to instrument-control.

13.The software can be updated to auto-profile in future by USB, no need to set profiles.