16 years High cost performance hot air  bga workstation RW-SP360C

Basic economy bga rework RW-SP360C

Specification:
Applicable PCB size
Max PCB size: 430mmX350mm
Applicable BGA size
Max size: 55mmX55mm
Min size: 7mmX7mm
Max weight: 80g
Power for operation: 3600W
Main heater: 800W
Lower heater: 800W
Bottom heater: 2000W
Machine dimension: 650*500*600mm
Machine weight: 33KG
Input power: AC 220V 3.6KW

Description:
High quality heating material produces high-tem breeze, precisely controlling the soldering
and desoldering process.
Movable heating head, able to move horizontally; easy to operate;
Embedded industrial computer, touch screen interface, PLC control; real-time temperature
curve display, able to display set curve and practically-tested curve; 7.2’ high definition
screen, convenient for operation and observation;
Industrial computer able to store unlimited temperature curves, curve analysis can be done on
touch screen; both English and Chinese can be input;
The temperatures of the upper and lower heater can be precisely controlled according to set
temperatures; bottom constant temperature infrared heating area; appropriate temperature
control apparatus can ensure safe rework for BGA;
The BGA soldering supporting frame can micro-adjusted to avoid local sinkage;
Powerful cross flow can cool the lower heating area;

The adjustable PCB positioning supports, easy and fast to install PCB; special fixture for
installing allotype boards ;
with sound alarming function after finishing soldering or desoldering; hand vacuum pen easy
for picking up BGA;
Set with over temperature alarming and protection function;

Equipped with different hot gas nozzles, easy to replace; can be customized according to
specific needs;

The integrated design of machine and chassis is room-saving.