Specifications

Motherboard Repair Equipment
Movable heaters,3 heating
Equipped with different alloy nozzles
Alarming protection function

  Shuttle Star SP360C Laptop Motherboard  Repair Equipment for BGA Chips

Specification:

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Description

*  High quality heating material produces high-tem breeze, precisely controlling the soldering and desoldering process.

* Movable heating head, able to move horizontally; easy to operate;

*  Embedded industrial computer, touch screen interface, PLC control; real-time temperature curve display, able to display set curve and practically-tested curve; 7.2 high definition screen, convenient for operation and observation;

*  Industrial computer able to store unlimited temperature curves, curve analysis can be done on touch screen; both English and Chinese can be input;

*  The temperatures of the upper and lower heater can be precisely controlled according to set temperatures; bottom constant temperature infrared heating area; appropriate temperature control apparatus can ensure safe rework for BGA;

*  The BGA soldering supporting frame can micro-adjusted to avoid local sinkage;

*   Powerful cross flow can cool the lower heating area;

*  The adjustable PCB positioning supports, easy and fast to install PCB; special fixture for installing allotype boards ;

*  with sound alarming function after finishing soldering or desoldering; hand vacuum pen easy for picking up BGA;

*  Set with over temperature alarming and protection function;

*  Equipped with different hot gas nozzles, easy to replace; can be customized according to specific needs;

*  The integrated design of machine and chassis is room-saving.