Lead-free BGA  PGA solder flux pastes is suitable in repairs of SMD and so on handset PCB, BGA and PGA helps the soldering paste, it uses activator of system in the low ionicity, the Run tin speed is quick, the belching smoke degree is very low, after the residuum solidifies, the surface insulation resistance value is very high, therefore, electric properties of disturbances to communication product and so on handset is small.