Vacuum thermocompression bonder for Hard plastic chips(PMMA/PC) features：

(1) the use of constant temperature control heating technology, precise temperature control;

(2) aluminum work platform, the upper and lower surface formation, heat conduction speed, thermal conductivity are uniform;

(3) heating area, covering the commonly used size chip;

(4) air cooling, cooling rate uniform, help to improve the bonding effect;

(5) the pressure is precisely adjustable, different pressure control for different materials;

(6) a unique vacuum hot pressing system, the chip is not damaged in the case of greatly improve the bonding