1. Product use
For SCA/OCA adhesive process product bonding is suitable for liquid crystal, TP/LCM and various types of related products at high temperature bonding, and can be used to place the fixture betw-een the workpiece to be bonded in the corresponding position, through the upper and lower pressure plate heating and vacuuming to remove bubbles to achieve complete bonding.
2. equipment characteristics
-Fit stability is effectively controlled with AirTAC custom cylinders
-The upper and lower pressure plate heating is controlled by Japanese Omron temperature controller
SMC is used for pressure control, and the balance of pressure is controlled by back pressure adjustment to improve the effect of pressure

Operation process
1. Product placement: According to the alignment fixture made by the product, the product is placed on the external fixture of the machine, and the product is moved to the working platform after the product is fitted.
2. Product platform entry: cylinder + guide rail
3. vacuum chamber pressure: the cylinder drives the chamber pressure
4. can be set heating to a constant temperature
5. vacuum after reaching the set value for laminating
6. Decompress, the cavity rises, and the platform moves out of the cycle