High lead silver solder paste

Alloy: Sn5Ag2.5Pb92.5

Melting point: 287 ° C

It is a high-lead, high-melting alloy with a lead content of more than 85%. It meets the exemption regulations of the ROHS Directive. It is usually applied to the packaging and soldering of power semiconductors. Its alloy has good compatibility with gold, copper and silver, and has high welding strength and residual resistance. .

Solder paste: 1, printing fluidity and tin drop is good, can also be finely printed for pads below 0.4MM pitch. 2, when continuous printing, its fineness changes are very small, the steel wire can operate for more than 8 hours, it will not dry, and still maintain good printing effect.

3, the original shape remains for a few hours after printing, basically no slump, the components will not be offset.

4, with ** welding performance, can appear appropriate wettability in different parts.

5, can adapt to different grades of welding equipment requirements, no need to complete welding in the nitrogen-filled environment, can still show good welding performance in the wide reflow oven temperature range,

6, the residue after welding is very small, the color is very light and has a large insulation resistance, will not corrode the PCB, can achieve the no-clean effect.

7, applicable: power tube, diode, triode, thyristor, rectifier, small integrated circuit and other package soldering

Type: Syringe solder paste, solder paste canned

Packing specification: 100g / support, 500g.