The no-clean solder paste is a high-reliability flux which is scientifically compounded with a polymer film-forming agent, a modified resin, an organic active agent and a high-molecular alcohol ether solvent, and has a high-quality sphericity, uniform distribution of powder particles, and low oxygen content. The Sn63/Pb37 alloy powder is refined and has excellent rheology, good printing moldability, and is not easy to collapse. The flux activity is moderate and the weldability is good. It can effectively match various lead-containing solders and is an ideal no-clean solder paste for soldering with lead soldering.

The flux system is scientifically selected and developed according to the welding mechanism, which can effectively reduce the free energy of the solder and reduce the surface tension.

  Improve the fluidity and solderability of the molten solder.

  It has excellent continuous printing property, especially suitable for fine pitch printing, good off-molding moldability, strong adhesion and easy to collapse.

  The reflow process window is wide, and excellent soldering results can be achieved in a wide reflow soldering temperature zone.

  Excellent solderability, full solder on the solder joints, bright, strong tin-transparent, low soldering failure rate.

  Residual residue after welding, uniform spreading, not easy to absorb moisture, no cleaning, excellent ICT test performance, surface insulation

  High resistance and reliable electrical performance.

This product can be used with surface-treated PCBs such as bare copper, gold-plated, and tin-plated plates, and various other lead-based solder alloy components.

  In computer motherboards, mobile phones, MP3, MP4, communication equipment, audio and video equipment, refrigeration equipment, vehicle equipment, instrumentation, medical

  Widely used in equipment and other high reliability, high quality electronic appliances