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Liquefied Gas Refrigerant R23 CHF3 Gas CAS 75-45-7 Electron Grade

Description:

Refrigerant Gas Trifluoromethane is a colorless nonflammable gas. Trifluoromethane is shipped as a liquid under pressure. Trifluoromethane may be narcotic in high concentrations. Under prolonged exposure to fire or heat the containers may rupture violently and rocket. Trifluoromethane is used as a refrigerant.

TRIFLUOROMETHANE, R-23, is chemically inert in many situations, but can react violently with strong reducing agents such as the very active metals and the active metals. They suffer oxidation with strong oxidizing agents and under extremes of temperature.

Vapors may cause dizziness or asphyxiation without warning. Vapors from liquefied gas are initially heavier than air and spread along ground. Contact with gas or liquefied gas may cause burns, severe injury and/or frostbite. Fire may produce irritating, corrosive and/or toxic gases.

Some may burn but none ignite readily. Containers may explode when heated. Ruptured cylinders may rocket.

Fluoroform is the chemical compound with the formula CHF3. It is one of the "haloforms", a class of compounds with the formula CHX3 (X = halogen). Fluoroform is used in diverse niche applications and is produced as a by-product of the manufacture of Teflon. It is also generated biologically in small amounts apparently by decarboxylation of trifluoroacetic acid

Specifications:

1. Physical properties

Commodity	Trifluoromethane
Molecular Formula	CHF3
CAS No.	75-46-7
UN No.	1984
Hazardous Class	2.2
Cylinder Capacity	500L
Filling Weight	380kg/500L refillable cylinder
Storage and Transportation	Use, store and transport below 45C. Store in cool and well-ventilated areas. Keep away from fire, heat, sunlight and flammable substances. Handle carefully when loading and unloading to avoid damages to gas cylinders and accessories.

2. Typical technical data

Trifluoromethane(R23)
Physical properties
Molecular formula	CHF3
Molecular weight	70.01
Boiling point(℃)	-82.1
Critical temperature (℃)	25.9
Critical pressure (MPa)	4.84
Specific Heat of Liquid, 30℃, [KJ/(kg℃)]	1.55
ODP	0.00
GWP	1.17
Ice Point,°C	-152.15

Quality index
Purity	≥99.5%
Water content	≤20ppm
Acidity	≤1ppm
Evaporation residue	≤800ppm
Appearance	Colorless and clear
Odor	Odorless

Applications:

Used for supercritical extraction solvent, low temperature refrigerant and substitute for Halon fire extinguishant	As the fire extinguishing agent and preparation of tetrafluoroethylene materials, electronic industrial plasma chemical etching agent and fluoride compounds.
Plasma etching gases for microelectronics industry Used in plasma etching of silicon oxide or nitride layers.	The etching of silicon dioxide film has the advantages of fast etching speed and good selectivity. In addition, fluoride is also used in low temperature refrigerant mixture, organic synthesis intermediate, infrared detector direct coolant and so on.
Refrigerant and tetrafluoroethylene materials	Low temperature refrigerant and as fire extinguishing agent and preparation of tetrafluoroethylene materials.