Custom Excimer Laser Gases Argon Fluoride Laser For 193nm Lithography
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Custom Excimer Laser Gases Argon Fluoride Laser For 193nm Lithography
Description:
Argon Fluoride Mixtures are used in 193 nm lithography applications, usually in conjunction with an inert gas mixture.
The argon fluoride laser is a particular type of excimer laser, which is sometimes called an exciplex laser. With its 193 nanometer wavelength, it is a deep ultraviolet laser, which is commonly used in the production of semiconductor integrated circuits, eye surgery, micromachining, and scientific research. The term excimer is short for "excited dimer", while exciplex is short for "excited complex". An excimer laser typically uses a mixture of a noble gas and a halogen gas, which under suitable conditions of electrical stimulation and high pressure, emits coherent stimulated radiation in the ultraviolet range.
ArF excimer lasers are widely used in high-resolution photolithography machines, one of the critical technologies required for microelectronic chip manufacturing. Excimer laser lithography has enabled transistor feature sizes to shrink from 800 nanometers in 1990 to 22 nanometers in 2012.
Specifications:
1. Physical properties
Commodity | Argon Fluoride gas |
Molecular Formula | ArF |
Phase | Gas |
Color |
Colorless |
Hazardous class for transort | 2.2 |
2. Typical technical data (COA)
Major Components | |||
COMPONENTS | CONCENTRATION | RANGE | |
Fluorine | 1.0% | 0.9-1.0% | |
Argon | 3.5% | 3.4-3.6% | |
Neon | Balance | ||
Maxinum Impurities | |||
COMPONENT | CONCENTRATION(ppmv) | ||
Carbon Dioxide (CO2) | <5.0 | ||
Carbon Monoxide (CO) | <1.0 | ||
Carbon Tetrafluoride (CF4) | <2.0 | ||
Carbonyl Fluoride (COF2) | <2.0 | ||
Helium (He) | <8.0 | ||
Moisture (H2O) | <25.0 | ||
Nitrogen (N2) | <25.0 | ||
Nitrogen Trifluoride (NF3) | <1.0 | ||
Oxygen (O2) | <25.0 | ||
Silicon Tetrafluoride (SiF4) | <2.0 | ||
Sulfur Hexafluoride (SF6) | <1.0 | ||
THC (as Methane) (CH4) | <1.0 | ||
Xenon (Xe) | <10.0 |
3. Package
Cylinder Specifications | Contents | Pressure | ||||
Cylinder | Valve Outlet Options | Cubic Feet | Liters | PSIG | BAR | |
1 | CGA679 | DISS 728 | 265 | 7500 | 2000 | 139 |
2 | CGA679 | DISS 728 | 212 | 6000 | 2000 | 139 |
3 | CGA679 | DISS 728 | 71 | 2000 | 1800 | 125 |
Applications:
Argon Fluoride Mixtures are used in 193 nm lithography applications, usually in conjunction with an inert gas mixture.