PTH: 0.25mm

NPTH: 0.15mm

Base material: FR4 (TG150)

Layers count: two

Board thickness: 1.6mm

Copper thickness: 1oz

Surface finish: immersion gold and gold finger, HAL, ENIG, OSP and gold finger

Solder mask colors: white

Size: 120.5 x 116.3mm/1up

Base materials: FR4, aluminum, FPC, copper and GBR

Copper thickness: 0.5oz (minimum)

Copper thickness: 4oz (maximum)

Board thickness: 0.2mm (minimum)

Board thickness: 3.2mm (maximum)

Possible solder mask colors: green, black, white, yellow and blue

Board dimension: 600 x 1,000mm

Hole diameter: 0.2mm (minimum)

Line width: 0.075mm (minimum)

Minimum line spacing: 0.075mm

SMT pitch: 30 degrees (minimum)

Annular ring: 0.05mm (minimum)

Aspect ratio: 11:01

Surface/hole plating tolerance

Hole tolerance:

SM tolerance (LPI)

Certificate: RoHS