Base materials: FR4, aluminum, FPC and copper

Minimum copper thickness: 0.5oz

Maximum copper thickness: 4oz

Minimum board thickness: 0.2mm

Maximum board thickness: 3.2mm

Surface finishing: HAL, ENIG, OSP, gold finger, chem and tin

Possible soldermask colors: green, black, white, yellow, blue, red and more

Board dimensions: 600 x 1,000mm

Minimum hole diameter: 0.2mm

Minimum line width: 0.075mm

Minimum line spacing: 0.075mm

Minimum SMT pitch: 30°

Minimum annular ring: 0.05mm

Aspect ratio: 11:01

Hole tolerance: