Layers: 4

Base material: FR4

Copper thickness: 1oz

Board thickness: 1.0mm

Minimum hole size: 0.45mm

Minimum line width: 3 mils

Minimum line spacing: 3 mils

Surface finishing: gold immersion

Hole tolerance (PTH): 0.25mm

Hole tolerance (NPTH): 0.15mm

SM tolerance (LPI): Dimension

Electrically test: supported

With RoHS Directive-compliant

Possibility of SMT device mounting: supported 

Base materials: FR4, aluminum, FPC and copper

Copper thickness: 0.5oz (minimum)

Copper thickness: 4oz (minimum)

Board thickness: 0.2mm (minimum)

Board thickness: 3.2mm (maximum)

Surface finishing: HAL, ENIG, OSP, gold finger and tin chemistry

Possible soldermask colors: green, black, white, yellow, blue, red and more

Board dimensions: 600 x 1,000mm

Hole diameter: 0.2mm (minimum)

Line width: 0.075mm (minimum)

Line spacing: 0.075mm (minimum)

SMT pitch: 30° (minimum)

Annular ring: 0.05mm (minimum)

Aspect ratio: 11:01

Surface/hole plating tolerance: