Specifications

BGA soldering station
* Close loop PID control, temperture precise and steady;
* solder BGA chips of different specifications

BGA Soldering Station

 

Specification:

Heating board dimension: L200×W150mm T

emperature range: 0~400^oC
Heating board material: AL
Heating power: 800W
Machine dimension: L327×W200×H110mm
Weight: Appox. 5Kgs

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Description:

* Made of quality heating material, controlling temperature stably;

* Close loop PID control completely , temperture is precision and steady;

* Able to solder BGA chip of different specifications at the same time.