BGA Solder Station

Specification

1. Heating board dimension: L240*W180mm
2. Temperature control: K-type Thermocouple, close cycle controlled
3. Heating power: 1800W
4. Power supply: Single-phase 220V, 50/60Hz, 1.8KW
5. Machine dimension: L360*W300*H150mm
6. Machine weight: Approx. 10Kgs

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 Features:

1. Quality heating material and digital readout of temperature and time, for stable temperature   control
2. Heat resistant glass cover for easy observation of soldering state and elimination of environmental interference
3. K-type thermocouple, close loop control, precise temperature control
4. Axial flow fan ensures safe temperature in the cabinet
5. Bottom aluminum alloy board heating, with little fluctuation; lessn damage to BGA chips
6. Capable of soldering various BGAs at the same time
7. Buzz when soldering finished