2016 Shuttle Star Die-bonding VCSEL/PD Platform with Micron accuracy
USD $1 - $1 /Set
Min.Order:1 Set
Shenzhen Shuttle Star Industrial Co., Ltd.
2017 New product Shuttle Star DIE WAFER micro assembly machine M5
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M5 is a multifunctional micro assembly machine, better than 5μm 3σ alignment accuracy.
It can be integrated with Eutectic Die Bonding Module, Bonding Force Module,
Dispenser Module,UV Curing Module, Process Observing Module, Ultrasonic Bonding Module
to reach different customers’ requirement.
It is mainly used for assembly medical CT Detector, Fiber-optic communication VCSEL/PD/LENS,LD Bar,RFID and MEMS/MOEMS Sensor field etc
Feature:
Placement Accuracy:±2.5μm 3σ
Working Area:X: 340mm, Y:150mm, Z:20mm
Bonding Force:0.1N~200N
Heating Temperature:25℃~400℃
Component Size: 0.1mm~40mm
Application Field:
Die-bondig for all nm size component
If you want to know more about us,welcome contact me:
Skype:lilies-lee
Whats App:0086 18820220117
Thank you for your time !