Might has capability to handle range from prototype, High-Mix Low Volume to High Volume Low Cost for Amplifier PCB Assembly (Hi-Fi Electronic) at  three manufacturing sites of Taiwan and China.

Might integrates quality ISO & TS16949 certified systems and innovative PCB assembly technologies to deliver market-leading consumer electronic products, from product assembly through enclosures to testing and packaging. Might SMT & Thru-hole lines utilize the most advanced technologies in the industry.

• SMD package, Chip-on-board and Flip Chip assembly technique
• 0201 chip, Micro BGA, u-BGA, QFN and LGA assembly
• AI and Thru-hole assembly
• RoHS, REACH compliance and Lead-Free solder technology
• Chip Programming
• Conformal Coating
• ICT test and AOI inspection
• ESD Protection Control Procedure
• IPC-A-610E Class II and Class III Workmanship Standard

- Our Products Application -

- Our Certificates -  ISO9001 / ISO14001 / TS16949 / UL / TUV / CE / 3C

Please visit our website for more details: .tw